Smart 3D Coaxial Line Confocal Sensors

The Next Level of 3D

LMI Technologies new Gocator 4000 series introduces coaxial line confocal sensor technology to provide high-speed, high-resolution, and versatile 3D inline inspection performance with angular range (Max. slope angle up to +/-85°). The sensors have 1,920 points/profile for shadow-free 3D measurement and inspection, resolutions up to 1.9µm, a FoV up to 5.0mm and speeds up to 16kHz.

Bild: LMI Technologies GmbHBild: LMI Technologies GmbH

Line confocal sensor technology leverage the principle of chromatic confocal imaging to deliver reliable, accurate, and reproducible dimensional measurements with high resolution and speed.

Bild: LMI Technologies GmbHBild: LMI Technologies GmbH

Bild: LMI Technologies GmbHBild: LMI Technologies GmbH

One optical design format for these sensors is called coaxial. Coaxial design uses a single axis where both illumination and detection occur along the same optical path. Light is focused onto the sample through a lens system, and the reflected light is collected by the same lens system and directed towards the detector. This coaxial arrangement eliminates the need for separate illumination and detection paths, simplifying the optical setup. The alignment of illumination and imaging pathways along a common optical axis also ensures optimal focusing and imaging of the target object, while eliminating shadowing effect, minimizing optical aberrations, and maximizing signal fidelity. Combining that with chromatic confocal imaging principles, including spatial filtering and depth discrimination, enables precision scanning of specific focal planes while rejecting out-of-focus light -- enhancing resolution and contrast as a result. Coaxial line confocal sensors, such as the Gocator 4000 Series from LMI Technologies, are an excellent option due to their ability to scan simple and complex surface topologies with zero shadowing effect for improved data quality and more accurate measurement results on steep-angled features (e.g., step height of PCB chips), deep grooves (e.g., wafer die factures), and protruding components (e.g., IC wire bonds).

LMI Technologies GmbH

Dieser Artikel erschien in inVISION 3 (Mai) 2024 - 29.05.24.
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